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(C1-S1-EN) The course provides an overview of the development history and key stages of the Internet of Things and then focus on practical applications of smart manufacturing in the semiconductor industry, including device integration, data acquisition, and process integration technologies. Through real-world case studies, the course shares the challenges and solutions for integration in diverse and heterogeneous device environments

(C1-S2-EN) This course discusses the application of the Internet of Things (IoT) in high-tech manufacturing, with a particular focus on smart manufacturing solutions. A practical case study demonstrates how an IoT gateway using a 4G mobile network and MDVPN collects and processes real-time data from digital meters and robotic arm vibration accelerators

(C1-S2-EN PART2) This course discusses the application of the Internet of Things (IoT) in high-tech manufacturing. Real case study demonstrates how an IoT gateway using a 4G mobile network and MDVPN collects and processes real-time data from digital meters and robotic arm vibration accelerators

(C1-S3-EN) This session explores how to achieve intelligent integration in the semiconductor manufacturing field through an Internet of Things (IoT) platform. It introduces IO-Link point-to-point communication protocol technology, connecting smart sensors and actuators to achieve high-speed, real-time data exchange and supporting device diagnostics and remote configuration, which is crucial for improving the flexibility and efficiency of automation systems

(C1-S3-EN PART 2) This session explores and demostrates how to achieve intelligent integration in the semiconductor manufacturing field through an Internet of Things (IoT) platform.

(C1-S4-EN) The course introduces the SECS/GEM communication protocol, a widely used standard in semiconductor manufacturing equipment, emphasizing its importance in enabling equipment interoperability, data exchange, and process control. It also mentions the application of technologies such as HSMS, Modbus, Bluetooth, and 4G/5G communication modules in smart manufacturing, demonstrating through concrete examples how to bridge legacy equipment that does not support SECS/GEM.

(C1-S4-EN PART 2) The course introduces the SECS/GEM communication protocol, a widely used standard in semiconductor manufacturing equipment, demonstrating through concrete examples how to bridge legacy equipment that does not support SECS/GEM

(C1-S5-EN) This course explores the application of Bluetooth Internet of Things (IoT) integration in factory IoT integration. It also explains in detail the application of various Bluetooth profiles in data transmission, focusing on key considerations such as low power consumption, ease of configuration, broad support, and functional scalability. The core functions of the Nordic NRF52840 module are introduced, discussing low-power mode programming and implementation, and how to wake up devices via RTC and external interrupts

(C1-S6-EN) This course introduces a practical application case of Bluetooth IoT system integration—the integration of passive infrared (PIR) sensing devices. It analyzes the application's system architecture, including the collaboration methods among the sensor layer, IoT gateway, local application server, and cloud server. It also shares application scenarios for NUS services and different power modes, illustrating how to extend battery life and optimize system performance.